Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were perfor...

Descripción completa

Detalles Bibliográficos
Autores principales: Jian, Minghong, Hamasha, Sa’d, Alahmer, Ali, Hamasha, Mohammad, Wei, Xin, Belhadi, Mohamed El Amine, Hamasha, Khozima
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860951/
https://www.ncbi.nlm.nih.gov/pubmed/36676490
http://dx.doi.org/10.3390/ma16020750

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860951/
https://www.ncbi.nlm.nih.gov/pubmed/36676490
http://dx.doi.org/10.3390/ma16020750

Ejemplares similares