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Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
Solder joints are subjected to varied stress cycle circumstances in the electronic packaging service life but are also influenced by aging. There has been limited investigation into the influence of aging and varying cycles on SnAgCu-Bi (SAC-Bi) solder joint fatigue. Cyclic fatigue tests were perfor...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9860951/ https://www.ncbi.nlm.nih.gov/pubmed/36676490 http://dx.doi.org/10.3390/ma16020750 |