Multi-Grid Capacitive Transducers for Measuring the Surface Profile of Silicon Wafers

The measurements of wafers’ surface profile are crucial for safeguarding the fabrication quality of integrated circuits and MEMS devices. The current techniques measure the profile mainly by moving a capacitive or optical spacing sensing probe along multiple lines, which is high-cost and inefficient...

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Detalles Bibliográficos
Autores principales: Zheng, Panpan, Cai, Bingyang, Zhu, Tao, Yu, Li, Wu, Wenjie, Tu, Liangcheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863230/
https://www.ncbi.nlm.nih.gov/pubmed/36677183
http://dx.doi.org/10.3390/mi14010122

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863230/
https://www.ncbi.nlm.nih.gov/pubmed/36677183
http://dx.doi.org/10.3390/mi14010122

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