Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application

In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by Cu plating, and detected the final structure and electric properties of the TSVs. The S...

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Detalles Bibliográficos
Autores principales: Feng, Liuhaodong, Zeng, Shuwen, Su, Yongquan, Wang, Lihao, Xu, Yang, Guo, Song, Chen, Shuo, Ji, Yucheng, Peng, Xinlin, Wu, Zhenyu, Wang, Shinan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863637/
https://www.ncbi.nlm.nih.gov/pubmed/36677165
http://dx.doi.org/10.3390/mi14010102

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863637/
https://www.ncbi.nlm.nih.gov/pubmed/36677165
http://dx.doi.org/10.3390/mi14010102

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