Cargando…

Process Optimization and Performance Evaluation of TSV Arrays for High Voltage Application

In order to obtain high-quality through-silicon via (TSV) arrays for high voltage applications, we optimized the fabrication processes of the Si holes, evaluated the dielectric layers, carried out hole filling by Cu plating, and detected the final structure and electric properties of the TSVs. The S...

Descripción completa

Detalles Bibliográficos
Autores principales:	Feng, Liuhaodong, Zeng, Shuwen, Su, Yongquan, Wang, Lihao, Xu, Yang, Guo, Song, Chen, Shuo, Ji, Yucheng, Peng, Xinlin, Wu, Zhenyu, Wang, Shinan
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2022
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9863637/ https://www.ncbi.nlm.nih.gov/pubmed/36677165 http://dx.doi.org/10.3390/mi14010102

Ejemplares similares

A Composite-Type MEMS Pirani Gauge for Wide Range and High Accuracy
por: Chen, Shuo, et al.
Publicado: (2023)

Structural Optimization and Mechanical Simulation of MEMS Thin-Film Getter–Heater Unit
por: Peng, Xinlin, et al.
Publicado: (2022)

Design of a High Sensitivity Pirani Gauge Based on Vanadium Oxide Film for High Vacuum Measurement
por: Guo, Song, et al.
Publicado: (2022)

Selection of TSV process
por: Re, V.
Publicado: (2016)

Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV
por: Wu, Houya, et al.
Publicado: (2020)

Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array
por: Wang, Xianglong, et al.
Publicado: (2023)

WAFER POSTPROCESSING (THINNING, TSV)
por: Moser, Hans-Gunther
Publicado: (2013)

3D Interconnection with TSV
por: Moser, H-G
Publicado: (2014)

Trichodysplasia spinulosa-Associated Polyomavirus (TSV) and Merkel Cell Polyomavirus: Correlation between Humoral and Cellular Immunity Stronger with TSV
por: Kumar, Arun, et al.
Publicado: (2012)

Through Silicon Via (TSV) Experience in Medipix
por: CAMPBELL, Michael
Publicado: (2014)

Design-for-test and test optimization techniques for TSV-based 3D stacked ICs
por: Noia, Brandon, et al.
Publicado: (2014)

Wearable Multi-Channel Pulse Signal Acquisition System Based on Flexible MEMS Sensor Arrays with TSV Structure
por: Kang, Xiaoxiao, et al.
Publicado: (2023)

A RF Redundant TSV Interconnection for High Resistance Si Interposer
por: Wang, Mengcheng, et al.
Publicado: (2021)

Corrosion des isolateurs des aimants TSV du booster
por: Chanel, M
Publicado: (1977)

Corrosion des isolateurs des aimants tsv du booster
por: Chanel, Μ, et al.
Publicado: (1977)

Quality control of the TSV multi-pixel photon counter arrays, and modules for the external plate of EndoTOF-PET ultrasound detector
por: Liu, Z, et al.
Publicado: (2015)

A via last TSV process applied to ATLAS pixel detector modules: proof of principle demonstration
por: Barbero, M, et al.
Publicado: (2012)

Experiment and simulation of single inhibitor SH110 for void-free TSV copper filling
por: Wang, Fuliang, et al.
Publicado: (2021)

A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging
por: Meng, Min, et al.
Publicado: (2019)

TSV last for hybrid pixel detectors: Application to particle physics and imaging experiments
por: Henry, D, et al.
Publicado: (2015)

Final design review of deliverable D4.3 (TSV in 65nm)
por: Re, Valerio
Publicado: (2017)

Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
por: Shih, Jian-Yu, et al.
Publicado: (2014)

The roles and prognostic significance of ABI1-TSV-11 expression in patients with left-sided colorectal cancer
por: Zhang, Yu, et al.
Publicado: (2021)

AlScN Piezoelectric MEMS Mirrors with Large Field of View for LiDAR Application
por: Liu, Yichen, et al.
Publicado: (2022)

Tsv-N1: A Novel DNA Algal Virus that Infects Tetraselmis striata
por: Pagarete, António, et al.
Publicado: (2015)

Small animal PET based on 16x16 TSV-MPPCs and monolithic crystals
por: Gonzalez, Antonio, et al.
Publicado: (2015)

Inkjet printing technology for increasing the I/O density of 3D TSV interposers
por: Khorramdel, Behnam, et al.
Publicado: (2017)

Transcriptome Analysis of Pacific White Shrimp (Litopenaeus vannamei) Hepatopancreas in Response to Taura Syndrome Virus (TSV) Experimental Infection
por: Zeng, Digang, et al.
Publicado: (2013)

In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures
por: Wu, Chenglin, et al.
Publicado: (2019)

A low-cost concurrent TSV test architecture with lossless test output compression scheme
por: Lee, Young-woo, et al.
Publicado: (2019)

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)
por: Kim, Youjung, et al.
Publicado: (2020)

Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
por: Shen, Wen-Wei, et al.
Publicado: (2017)

Introgression of tsv1 improves tungro disease resistance of a rice variety BRRI dhan71
por: Hore, Tapas Kumer, et al.
Publicado: (2022)

Stress Impact of the Annealing Procedure of Cu-Filled TSV Packaging on the Performance of Nano-Scaled MOSFETs Evaluated by an Analytical Solution and FEA-Based Submodeling Technique
por: Huang, Pei-Chen, et al.
Publicado: (2021)

Rice TSV2 encoding threonyl-tRNA synthetase is needed for early chloroplast development and seedling growth under cold stress
por: Lin, Dongzhi, et al.
Publicado: (2021)

Operation of NIST Josephson Array Voltage Standards
por: Hamilton, Clark A., et al.
Publicado: (1990)

Ultrasound biomicroscopy findings of 25 G Transconjuctival sutureless (TSV) and conventional (20G) pars plana sclerotomy in the same patient
por: Keshavamurthy, Ravi, et al.
Publicado: (2006)

Inkjet-printed stretchable and low voltage synaptic transistor array
por: Molina-Lopez, F., et al.
Publicado: (2019)

Performance evaluation of optimal real-time polymerase chain reaction achieved with reduced voltage
por: Hwang, Ji-Soo, et al.
Publicado: (2018)

Rice TSV3 Encoding Obg-Like GTPase Protein Is Essential for Chloroplast Development During the Early Leaf Stage Under Cold Stress
por: Lin, Dongzhi, et al.
Publicado: (2017)

Cannot write session to /tmp/vufind_sessions/sess_c0mo2iususbaikle0n62lcqp15