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Adhesion Evaluation of an Embedded SiN/GaAs Interface Using a Novel “Push-Out” Technique
Adhesion assessments of an embedded interface in a multilayer system that contains a ductile layer are challenging. The occurrence of plastic deformation in the ductile layer often leads to additional complexity in analysis. In this study, an innovative “push-out” technique was devised to evaluate t...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9864989/ https://www.ncbi.nlm.nih.gov/pubmed/36677098 http://dx.doi.org/10.3390/mi14010037 |