An Automatic Detection Method for Cutting Path of Chips in Wafer

HIGHLIGHTS: Cutting path Planning System for wafer images without Mark points in different imaging states. Use the interlayer in the chip region as an auxiliary location to determine the cutting path. The determined cutting path is located in the middle of the streets, away from the chip region. ABS...

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Detalles Bibliográficos
Autores principales: Wang, Yuezong, Jia, Haoran, Jia, Pengxuan, Chen, Kexin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2022
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9866774/
https://www.ncbi.nlm.nih.gov/pubmed/36677121
http://dx.doi.org/10.3390/mi14010059

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9866774/
https://www.ncbi.nlm.nih.gov/pubmed/36677121
http://dx.doi.org/10.3390/mi14010059

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