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An Automatic Detection Method for Cutting Path of Chips in Wafer
HIGHLIGHTS: Cutting path Planning System for wafer images without Mark points in different imaging states. Use the interlayer in the chip region as an auxiliary location to determine the cutting path. The determined cutting path is located in the middle of the streets, away from the chip region. ABS...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2022
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9866774/ https://www.ncbi.nlm.nih.gov/pubmed/36677121 http://dx.doi.org/10.3390/mi14010059 |