Microstructure and morphology of the soldering interface of Sn–2.0Ag–1.5Zn low Ag content lead-free solder ball and different substrates

Eutectic Sn–Ag–Cu lead-free solder has limited applications due to cost and reliability issues. Sn–Ag–Zn solder has the advantages of low melting point, good mechanical properties and reliable welding interface. However, the research system of low silver content Sn–Ag–Zn solder is incomplete. In thi...

Descripción completa

Detalles Bibliográficos
Autores principales: Xiao, Jin, Tong, Xing, Liang, Jinhui, Chen, Quankun, Tang, Qiming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2023
Materias:
Research Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9898020/
https://www.ncbi.nlm.nih.gov/pubmed/36747560
http://dx.doi.org/10.1016/j.heliyon.2023.e12952

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9898020/
https://www.ncbi.nlm.nih.gov/pubmed/36747560
http://dx.doi.org/10.1016/j.heliyon.2023.e12952

Ejemplares similares