Cargando…
Micromechanical BEoL robustness evaluation methods enabling loading condition customization and acoustic emission damage monitoring()
For micromechanical robustness evaluation methods, it is advantageous if the mechanical loading conditions applied can be controlled as precisely as possible. For microchips, this is required to determine the robustness under specific conditions, e.g. during assembly or characteristic application/us...
Autores principales: | Silomon, Jendrik, Chimeg, Dulguun, Clausner, André, Zschech, Ehrenfried |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Elsevier
2023
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9918789/ https://www.ncbi.nlm.nih.gov/pubmed/36785800 http://dx.doi.org/10.1016/j.mex.2023.102028 |
Ejemplares similares
-
An Investigation on the Most Likely Failure Locations in the BEoL Stack of a 20 nm Chip Due to Chip Package Interaction with the Use of Novel Semi-Elliptical Cracks
por: Li, Ganglong, et al.
Publicado: (2023) -
Numerical and Experimental Study of the Mechanical Response of Diatom Frustules
por: Topal, Emre, et al.
Publicado: (2020) -
Morphology and Mechanical Properties of Fossil Diatom Frustules from Genera of Ellerbeckia and Melosira
por: Li, Qiong, et al.
Publicado: (2021) -
Fully Printed Zinc Oxide Electrolyte-Gated Transistors on Paper
por: Carvalho, José Tiago, et al.
Publicado: (2019) -
Wide range detector of plasma induced charging effect for advanced CMOS BEOL processes
por: Chao, Yi-Jie, et al.
Publicado: (2021)