Characterization of Mechanical, Electrical and Thermal Properties of Bismaleimide Resins Based on Different Branched Structures

Bismaleimide (BMI) resin is an excellent performance resin, mainly due to its resistance to the effect of heat and its insulating properties. However, its lack of toughness as a cured product hampers its application in printed circuit boards (PCBs). Herein, a branched structure via Michael addition...

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Detalles Bibliográficos
Autores principales: Cai, Haihui, Shi, Jiahao, Zhang, Xiaorui, Yang, Zhou, Weng, Ling, Wang, Qingye, Yan, Shaohui, Yu, Lida, Yang, Junlong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9919665/
https://www.ncbi.nlm.nih.gov/pubmed/36771893
http://dx.doi.org/10.3390/polym15030592

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9919665/
https://www.ncbi.nlm.nih.gov/pubmed/36771893
http://dx.doi.org/10.3390/polym15030592

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