UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning. Here we demonstrate the use of UV-Nanoimprint Lithography and Deep Reactive...

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Detalles Bibliográficos
Autores principales: Dirdal, Christopher A., Milenko, Karolina, Summanwar, Anand, Dullo, Firehun T., Thrane, Paul C. V., Rasoga, Oana, Avram, Andrei M., Dinescu, Adrian, Baracu, Angela M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920157/
https://www.ncbi.nlm.nih.gov/pubmed/36770397
http://dx.doi.org/10.3390/nano13030436

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920157/
https://www.ncbi.nlm.nih.gov/pubmed/36770397
http://dx.doi.org/10.3390/nano13030436

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