Interfacial Reaction and Electromigration Failure of Cu Pillar/Ni/Sn-Ag/Cu Microbumps under Bidirectional Current Stressing

The electromigration behavior of microbumps is inevitably altered under bidirectional currents. Herein, based on a designed test system, the effect of current direction and time proportion of forward current is investigated on Cu Pillar/Ni/Sn-1.8 Ag/Cu microbumps. Under thermo-electric stressing, mi...

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Detalles Bibliográficos
Autores principales: Fu, Zhiwei, Chen, Jian, Zhao, Pengfei, Guo, Xiaotong, Xiao, Qingzhong, Fu, Xing, Wang, Jian, Yang, Chao, Xu, Jile, Yang, Jia-Yue
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920230/
https://www.ncbi.nlm.nih.gov/pubmed/36770139
http://dx.doi.org/10.3390/ma16031134

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920230/
https://www.ncbi.nlm.nih.gov/pubmed/36770139
http://dx.doi.org/10.3390/ma16031134

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