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High Ampacity On-Chip Wires Implemented by Aligned Carbon Nanotube-Cu Composite
With the size of electronic devices shrinking to the nanometer scale, it is of great importance to develope new wire materials with higher current carrying capacity than traditional materials such as gold (Au) and copper (Cu). This is urgently needed for more efficient, compact and functional integr...
| Autores principales: | , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920244/ https://www.ncbi.nlm.nih.gov/pubmed/36770136 http://dx.doi.org/10.3390/ma16031131 |