Silicone-Based Thermally Conductive Gel Fabrication via Hybridization of Low-Melting-Point Alloy–Hexagonal Boron Nitride–Graphene Oxide

Thermal contact resistance between the microprocessor chip and the heat sink has long been a focus of thermal management research in electronics. Thermally conductive gel, as a thermal interface material for efficient heat transfer between high-power components and heat sinks, can effectively reduce...

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Detalles Bibliográficos
Autores principales: Chen, Peijia, Ge, Xin, Zhang, Zhicong, Yin, Shuang, Liang, Weijie, Ge, Jianfang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920594/
https://www.ncbi.nlm.nih.gov/pubmed/36770451
http://dx.doi.org/10.3390/nano13030490

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920594/
https://www.ncbi.nlm.nih.gov/pubmed/36770451
http://dx.doi.org/10.3390/nano13030490

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