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Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass
Quartz glass shows superior physicochemical properties and is used in modern high technology. Due to its hard and brittle characteristics, traditional polishing slurry mostly uses strong acid, strong alkali, and potent corrosive additives, which cause environmental pollution. Furthermore, the degree...
Autores principales: | , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2023
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920658/ https://www.ncbi.nlm.nih.gov/pubmed/36770160 http://dx.doi.org/10.3390/ma16031148 |
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author | Zhao, Zifeng Zhang, Zhenyu Shi, Chunjing Feng, Junyuan Zhuang, Xuye Li, Li Meng, Fanning Li, Haodong Xue, Zihang Liu, Dongdong |
author_facet | Zhao, Zifeng Zhang, Zhenyu Shi, Chunjing Feng, Junyuan Zhuang, Xuye Li, Li Meng, Fanning Li, Haodong Xue, Zihang Liu, Dongdong |
author_sort | Zhao, Zifeng |
collection | PubMed |
description | Quartz glass shows superior physicochemical properties and is used in modern high technology. Due to its hard and brittle characteristics, traditional polishing slurry mostly uses strong acid, strong alkali, and potent corrosive additives, which cause environmental pollution. Furthermore, the degree of damage reduces service performance of the parts due to the excessive corrosion. Therefore, a novel quartz glass green and efficient non-damaging chemical mechanical polishing slurry was developed, consisting of cerium oxide (CeO(2)), Lanthanum oxyfluoride (LaOF), potassium pyrophosphate (K(4)P(2)O(7)), sodium N-lauroyl sarcosinate (SNLS), and sodium polyacrylate (PAAS). Among them, LaOF abrasive showed hexahedral morphology, which increased the cutting sites and uniformed the load. The polishing slurry was maintained by two anionic dispersants, namely SNLS and PAAS, to maintain the suspension stability of the slurry, which makes the abrasive in the slurry have a more uniform particle size and a smoother sample surface after polishing. After the orthogonal test, a surface roughness (S(a)) of 0.23 nm was obtained in the range of 50 × 50 μm(2), which was lower than the current industry rating of 0.9 nm, and obtained a material removal rate (MRR) of 530.52 nm/min. |
format | Online Article Text |
id | pubmed-9920658 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2023 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-99206582023-02-12 Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass Zhao, Zifeng Zhang, Zhenyu Shi, Chunjing Feng, Junyuan Zhuang, Xuye Li, Li Meng, Fanning Li, Haodong Xue, Zihang Liu, Dongdong Materials (Basel) Article Quartz glass shows superior physicochemical properties and is used in modern high technology. Due to its hard and brittle characteristics, traditional polishing slurry mostly uses strong acid, strong alkali, and potent corrosive additives, which cause environmental pollution. Furthermore, the degree of damage reduces service performance of the parts due to the excessive corrosion. Therefore, a novel quartz glass green and efficient non-damaging chemical mechanical polishing slurry was developed, consisting of cerium oxide (CeO(2)), Lanthanum oxyfluoride (LaOF), potassium pyrophosphate (K(4)P(2)O(7)), sodium N-lauroyl sarcosinate (SNLS), and sodium polyacrylate (PAAS). Among them, LaOF abrasive showed hexahedral morphology, which increased the cutting sites and uniformed the load. The polishing slurry was maintained by two anionic dispersants, namely SNLS and PAAS, to maintain the suspension stability of the slurry, which makes the abrasive in the slurry have a more uniform particle size and a smoother sample surface after polishing. After the orthogonal test, a surface roughness (S(a)) of 0.23 nm was obtained in the range of 50 × 50 μm(2), which was lower than the current industry rating of 0.9 nm, and obtained a material removal rate (MRR) of 530.52 nm/min. MDPI 2023-01-29 /pmc/articles/PMC9920658/ /pubmed/36770160 http://dx.doi.org/10.3390/ma16031148 Text en © 2023 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Zhao, Zifeng Zhang, Zhenyu Shi, Chunjing Feng, Junyuan Zhuang, Xuye Li, Li Meng, Fanning Li, Haodong Xue, Zihang Liu, Dongdong Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title | Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title_full | Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title_fullStr | Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title_full_unstemmed | Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title_short | Dispersion and Polishing Mechanism of a Novel CeO(2)-LaOF-Based Chemical Mechanical Polishing Slurry for Quartz Glass |
title_sort | dispersion and polishing mechanism of a novel ceo(2)-laof-based chemical mechanical polishing slurry for quartz glass |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9920658/ https://www.ncbi.nlm.nih.gov/pubmed/36770160 http://dx.doi.org/10.3390/ma16031148 |
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