Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model

Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devices. Due t...

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Detalles Bibliográficos
Autores principales: Bani Hani, Dania, Al Athamneh, Raed, Abueed, Mohammed, Hamasha, Sa’d
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9925449/
https://www.ncbi.nlm.nih.gov/pubmed/36781927
http://dx.doi.org/10.1038/s41598-023-29636-3

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9925449/
https://www.ncbi.nlm.nih.gov/pubmed/36781927
http://dx.doi.org/10.1038/s41598-023-29636-3

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