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Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model
Reliability of the microelectronic interconnection materials for electronic packages has a significant impact on the fatigue properties of the electronic assemblies. This is due to the correlation between solder joints reliability and the most frequent failure modes seen in electronic devices. Due t...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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Nature Publishing Group UK
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9925449/ https://www.ncbi.nlm.nih.gov/pubmed/36781927 http://dx.doi.org/10.1038/s41598-023-29636-3 |