Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

[Image: see text] Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible circuits....

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Detalles Bibliográficos
Autores principales: Tsai, Yuan-Nan, Chin, Shih-Chieh, Chen, Hsin-Yo, Li, Ming-Syuan, Chen, Yi-Sheng, Wang, Yan-Lin, Yang, Ta-I, Tsai, Mei-Hui, Tseng, I-Hsiang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2023
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9933219/
https://www.ncbi.nlm.nih.gov/pubmed/36816649
http://dx.doi.org/10.1021/acsomega.2c07365

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9933219/
https://www.ncbi.nlm.nih.gov/pubmed/36816649
http://dx.doi.org/10.1021/acsomega.2c07365

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