Cargando…
Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer
[Image: see text] Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible circuits....
Autores principales: | Tsai, Yuan-Nan, Chin, Shih-Chieh, Chen, Hsin-Yo, Li, Ming-Syuan, Chen, Yi-Sheng, Wang, Yan-Lin, Yang, Ta-I, Tsai, Mei-Hui, Tseng, I-Hsiang |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical Society
2023
|
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9933219/ https://www.ncbi.nlm.nih.gov/pubmed/36816649 http://dx.doi.org/10.1021/acsomega.2c07365 |
Ejemplares similares
-
Sputtered anti-reflection layer on transparent polyimide substrate improves adhesion strength to copper layer: effects of layer thickness and sputtering power
por: Tsai, Yuan-Nan, et al.
Publicado: (2023) -
Polyimide-derived graphite barrier layer adhered to seed crystals to improve the quality of grown silicon carbide
por: Li, Ming-Syuan, et al.
Publicado: (2022) -
Transparent Thin-Film Transistors Based on Sputtered Electric Double Layer
por: Cai, Wensi, et al.
Publicado: (2017) -
Copper-Polyimide Multi-Layer Electrodes for the End-Cap Electromagnetic Calorimeter
por: Djama, F, et al.
Publicado: (1998) -
Mesogen-co-polymerized transparent polyimide as a liquid-crystal alignment layer with enhanced anchoring energy
por: Tong, Faqin, et al.
Publicado: (2018)