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Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
Soft Electronics In article number 2205795, Seung Hwan Ko and co‐workers aim to provide thorough knowledge about patterning methods and unique properties for liquid metal (LM)‐based future soft electronics. It is expected to bring advancements in future soft electronics owing to its conductivity, co...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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John Wiley and Sons Inc.
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9951362/ http://dx.doi.org/10.1002/advs.202370033 |