Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)

Soft Electronics In article number 2205795, Seung Hwan Ko and co‐workers aim to provide thorough knowledge about patterning methods and unique properties for liquid metal (LM)‐based future soft electronics. It is expected to bring advancements in future soft electronics owing to its conductivity, co...

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Detalles Bibliográficos
Autores principales: Kim, Minwoo, Lim, Hyungjun, Ko, Seung Hwan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2023
Materias:
Frontispiece
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9951362/
http://dx.doi.org/10.1002/advs.202370033
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author Kim, Minwoo
Lim, Hyungjun
Ko, Seung Hwan
author_facet Kim, Minwoo
Lim, Hyungjun
Ko, Seung Hwan
author_sort Kim, Minwoo
collection PubMed
description Soft Electronics In article number 2205795, Seung Hwan Ko and co‐workers aim to provide thorough knowledge about patterning methods and unique properties for liquid metal (LM)‐based future soft electronics. It is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. Since there are numerous LM patterning methods, this review helps to choose an appropriate patterning method based on comprehensive understanding. [Image: see text]
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spelling pubmed-99513622023-02-25 Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023) Kim, Minwoo Lim, Hyungjun Ko, Seung Hwan Adv Sci (Weinh) Frontispiece Soft Electronics In article number 2205795, Seung Hwan Ko and co‐workers aim to provide thorough knowledge about patterning methods and unique properties for liquid metal (LM)‐based future soft electronics. It is expected to bring advancements in future soft electronics owing to its conductivity, conformability, stretchability, and biocompatibility. Since there are numerous LM patterning methods, this review helps to choose an appropriate patterning method based on comprehensive understanding. [Image: see text] John Wiley and Sons Inc. 2023-02-24 /pmc/articles/PMC9951362/ http://dx.doi.org/10.1002/advs.202370033 Text en © 2023 Wiley‐VCH GmbH https://creativecommons.org/licenses/by-nc/4.0/This is an open access article under the terms of the http://creativecommons.org/licenses/by-nc/4.0/ (https://creativecommons.org/licenses/by-nc/4.0/) License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited and is not used for commercial purposes.
spellingShingle Frontispiece
Kim, Minwoo
Lim, Hyungjun
Ko, Seung Hwan
Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title_full Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title_fullStr Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title_full_unstemmed Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title_short Liquid Metal Patterning and Unique Properties for Next‐Generation Soft Electronics (Adv. Sci. 6/2023)
title_sort liquid metal patterning and unique properties for next‐generation soft electronics (adv. sci. 6/2023)
topic Frontispiece
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9951362/
http://dx.doi.org/10.1002/advs.202370033
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AT koseunghwan liquidmetalpatterninganduniquepropertiesfornextgenerationsoftelectronicsadvsci62023

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