Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter

Most microsensors are composed of devices and covers. Due to the complicated structure of the cover and various other requirements, it difficult to use wafer-level packaging with such microsensors. In particular, for monolithic microsensors combined with read-out ICs, the available process margins a...

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Detalles Bibliográficos
Autores principales: Kim, Taehyun, Han, Sangwug, Lee, Jubum, Na, Yeeun, Jung, Joontaek, Park, Yun Chang, Oh, Jaesub, Yang, Chungmo, Kim, Hee Yeoun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9959864/
https://www.ncbi.nlm.nih.gov/pubmed/36838148
http://dx.doi.org/10.3390/mi14020448

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9959864/
https://www.ncbi.nlm.nih.gov/pubmed/36838148
http://dx.doi.org/10.3390/mi14020448

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