Experimental and Numerical Studies on Hot Compressive Deformation Behavior of a Cu–Ni–Sn–Mn–Zn Alloy

Cu–9Ni–6Sn alloys have received widespread attention due to their good mechanical properties and resistance to stress relaxation in the electronic and electrical industries. The hot compression deformation behaviors of the Cu–9Ni–6Sn–0.3Mn–0.2Zn alloy were investigated using the Gleeble-3500 thermal...

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Detalles Bibliográficos
Autores principales: Zhang, Yufang, Xiao, Zhu, Meng, Xiangpeng, Xiao, Lairong, Pei, Yongjun, Gan, Xueping
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9960293/
https://www.ncbi.nlm.nih.gov/pubmed/36837075
http://dx.doi.org/10.3390/ma16041445

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9960293/
https://www.ncbi.nlm.nih.gov/pubmed/36837075
http://dx.doi.org/10.3390/ma16041445

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