Research Progress on Bonding Wire for Microelectronic Packaging

Wire bonding is still the most popular chip interconnect technology in microelectronic packaging and will not be replaced by other interconnect methods for a long time in the future. Au bonding wire has been a mainstream semiconductor packaging material for many decades due to its unique chemical st...

Descripción completa

Detalles Bibliográficos
Autores principales: Zhou, Hongliang, Zhang, Yingchong, Cao, Jun, Su, Chenghao, Li, Chong, Chang, Andong, An, Bin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9962244/
https://www.ncbi.nlm.nih.gov/pubmed/36838134
http://dx.doi.org/10.3390/mi14020432

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9962244/
https://www.ncbi.nlm.nih.gov/pubmed/36838134
http://dx.doi.org/10.3390/mi14020432

Ejemplares similares