MEMS Reliability: On-Chip Testing for the Characterization of the Out-of-Plane Polysilicon Strength

Polycrystalline silicon is a brittle material, and its strength results are stochastically linked to microscale (or even nanoscale) defects, possibly dependent on the grain size and morphology. In this paper, we focus on the out-of-plane tensile strength of columnar polysilicon. The investigation ha...

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Detalles Bibliográficos
Autores principales: Vicentini Ferreira do Valle, Tiago, Mariani, Stefano, Ghisi, Aldo, De Masi, Biagio, Rizzini, Francesco, Gattere, Gabriele, Valzasina, Carlo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9963482/
https://www.ncbi.nlm.nih.gov/pubmed/36838143
http://dx.doi.org/10.3390/mi14020443

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9963482/
https://www.ncbi.nlm.nih.gov/pubmed/36838143
http://dx.doi.org/10.3390/mi14020443

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