Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

This study analyzed the mechanism underlying the effect of the bonding current on the bonding interface during anodic bonding on the basis of the anodic bonding of PEG (polyethylene glycol)-based encapsulation materials and Al. By establishing an equivalent electrical model, the effects of various e...

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Detalles Bibliográficos
Autores principales: Du, Chao, Zhao, Yali, Li, Yong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9965209/
https://www.ncbi.nlm.nih.gov/pubmed/36850196
http://dx.doi.org/10.3390/polym15040913

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9965209/
https://www.ncbi.nlm.nih.gov/pubmed/36850196
http://dx.doi.org/10.3390/polym15040913

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