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Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum
This study analyzed the mechanism underlying the effect of the bonding current on the bonding interface during anodic bonding on the basis of the anodic bonding of PEG (polyethylene glycol)-based encapsulation materials and Al. By establishing an equivalent electrical model, the effects of various e...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9965209/ https://www.ncbi.nlm.nih.gov/pubmed/36850196 http://dx.doi.org/10.3390/polym15040913 |