Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish

Thermo-compression bonding (TCB) properties of Cu/SnAg pillar bumps on electroless palladium immersion gold (EPIG) were evaluated in this study. A test chip with Cu/SnAg pillar bumps was bonded on the surface-finished Cu pads with the TCB method. The surface roughness of the EPIG was 82 nm, which wa...

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Detalles Bibliográficos
Autores principales: Jun, So-Yeon, Bang, Jung-Hwan, Kim, Min-Su, Han, Deok-Gon, Lee, Tae-Young, Yoo, Sehoon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9965429/
https://www.ncbi.nlm.nih.gov/pubmed/36837369
http://dx.doi.org/10.3390/ma16041739

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9965429/
https://www.ncbi.nlm.nih.gov/pubmed/36837369
http://dx.doi.org/10.3390/ma16041739

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