Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications

A millimeter-wave substrate-integrated waveguide (SIW) was firstly demonstrated using the micromachining of photoetchable glass (PEG) for 5G applications. A PEG substrate was used as a dielectric material of the SIW, and its photoetchable properties were used to fabricate through glass via (TGV) hol...

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Detalles Bibliográficos
Autores principales: Chung, Seung-Han, Shin, Jae-Hyun, Kim, Yong-Kweon, Baek, Chang-Wook
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9966312/
https://www.ncbi.nlm.nih.gov/pubmed/36837988
http://dx.doi.org/10.3390/mi14020288

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9966312/
https://www.ncbi.nlm.nih.gov/pubmed/36837988
http://dx.doi.org/10.3390/mi14020288

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