Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

Highly (111)-oriented nanotwinned Cu (nt-Cu) films were fabricated on silicon wafers for thermal-stress characterization. We tailored the microstructural features (grain scale and orientation) of the films by tuning the electroplating parameters. The films were heat-treated and the relaxation behavi...

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Detalles Bibliográficos
Autores principales: Lai, Jyun-Yu, Tran, Dinh-Phuc, Yang, Shih-Chi, Tseng, I-Hsin, Shie, Kai-Cheng, Leu, Jihperng, Chen, Chih
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9967451/
https://www.ncbi.nlm.nih.gov/pubmed/36839077
http://dx.doi.org/10.3390/nano13040709

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9967451/
https://www.ncbi.nlm.nih.gov/pubmed/36839077
http://dx.doi.org/10.3390/nano13040709

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