Conduction Conditions for Self-Healing of Metal Interconnect Using Copper Microparticles Dispersed with Silicone Oil

This study clarifies the conditions for the bridging and conduction of a gap on a metal interconnect using copper microparticles dispersed with silicon oil. An AC voltage applied to a metal interconnect with a gap covered by a dispersion of metal microparticles traps the metal microparticles in the...

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Detalles Bibliográficos
Autores principales: Suetsugu, Naoki, Iwase, Eiji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9967765/
https://www.ncbi.nlm.nih.gov/pubmed/36838176
http://dx.doi.org/10.3390/mi14020475

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9967765/
https://www.ncbi.nlm.nih.gov/pubmed/36838176
http://dx.doi.org/10.3390/mi14020475

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