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Conduction Conditions for Self-Healing of Metal Interconnect Using Copper Microparticles Dispersed with Silicone Oil
This study clarifies the conditions for the bridging and conduction of a gap on a metal interconnect using copper microparticles dispersed with silicon oil. An AC voltage applied to a metal interconnect with a gap covered by a dispersion of metal microparticles traps the metal microparticles in the...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2023
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9967765/ https://www.ncbi.nlm.nih.gov/pubmed/36838176 http://dx.doi.org/10.3390/mi14020475 |