Comparison of CoW/SiO(2) and CoB/SiO(2) Interconnects from the Perspective of Electrical and Reliability Characteristics

As the feature size of integrated circuits has been scaled down to 10 nm, the rapid increase in the electrical resistance of copper (Cu) metallization has become a critical issue. To alleviate the resistance increases of Cu lines, co-sputtered CoW and CoB alloying metals were investigated as conduct...

Descripción completa

Detalles Bibliográficos
Autores principales: Cheng, Yi-Lung, Wang, Kai-Hsieh, Lee, Chih-Yen, Chen, Giin-Shan, Fang, Jau-Shiung
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2023
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968080/
https://www.ncbi.nlm.nih.gov/pubmed/36837082
http://dx.doi.org/10.3390/ma16041452

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968080/
https://www.ncbi.nlm.nih.gov/pubmed/36837082
http://dx.doi.org/10.3390/ma16041452

Ejemplares similares