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Comparison of CoW/SiO(2) and CoB/SiO(2) Interconnects from the Perspective of Electrical and Reliability Characteristics
As the feature size of integrated circuits has been scaled down to 10 nm, the rapid increase in the electrical resistance of copper (Cu) metallization has become a critical issue. To alleviate the resistance increases of Cu lines, co-sputtered CoW and CoB alloying metals were investigated as conduct...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2023
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9968080/ https://www.ncbi.nlm.nih.gov/pubmed/36837082 http://dx.doi.org/10.3390/ma16041452 |