Sidewall patterning of organic–inorganic multilayer thin film encapsulation by adhesion lithography

A simple sidewall patterning process for organic–inorganic multilayer thin-film encapsulation (TFE) has been proposed and demonstrated. An Al(2)O(3) thin film grown by atomic layer deposition (ALD) was patterned by adhesion lithography using the difference in interfacial adhesion strength. The diffe...

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Detalles Bibliográficos
Autores principales: Lee, Seung Woo, Cho, Heyjin, Jang, Choel-Min, Huh, Myung-Soo, Cho, Sung Min
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2023
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10390510/
https://www.ncbi.nlm.nih.gov/pubmed/37524726
http://dx.doi.org/10.1038/s41598-023-39155-w