Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration
Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In...
Autores principales: | , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
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MDPI
2016
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190075/ https://www.ncbi.nlm.nih.gov/pubmed/30404357 http://dx.doi.org/10.3390/mi7100184 |
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author | Fukushima, Takafumi Hashiguchi, Hideto Yonekura, Hiroshi Kino, Hisashi Murugesan, Mariappan Bea, Ji-Chel Lee, Kang-Wook Tanaka, Tetsu Koyanagi, Mitsumasa |
author_facet | Fukushima, Takafumi Hashiguchi, Hideto Yonekura, Hiroshi Kino, Hisashi Murugesan, Mariappan Bea, Ji-Chel Lee, Kang-Wook Tanaka, Tetsu Koyanagi, Mitsumasa |
author_sort | Fukushima, Takafumi |
collection | PubMed |
description | Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapor deposition (PE-CVD) as a MCtW bonding interface was mainly employed, and in addition, wafer-to-wafer thermocompression direct bonding was also used for comparison. N(2) or Ar plasmas were utilized for the surface activation. After plasma activation and the subsequent supplying of water as a self-assembly mediate, the chips with the PE-CVD oxide layer were driven by the liquid surface tension and precisely aligned on the host wafers, and subsequently, they were tightly bonded to the wafers through the MCtW oxide-oxide direct bonding technology. Finally, a mechanism of oxide-oxide direct bonding to support the previous models was discussed using an atmospheric pressure ionization mass spectrometer (APIMS). |
format | Online Article Text |
id | pubmed-6190075 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2016 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-61900752018-11-01 Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration Fukushima, Takafumi Hashiguchi, Hideto Yonekura, Hiroshi Kino, Hisashi Murugesan, Mariappan Bea, Ji-Chel Lee, Kang-Wook Tanaka, Tetsu Koyanagi, Mitsumasa Micromachines (Basel) Article Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In this study, chemical mechanical polish (CMP)-treated oxide formed by plasma-enhanced chemical vapor deposition (PE-CVD) as a MCtW bonding interface was mainly employed, and in addition, wafer-to-wafer thermocompression direct bonding was also used for comparison. N(2) or Ar plasmas were utilized for the surface activation. After plasma activation and the subsequent supplying of water as a self-assembly mediate, the chips with the PE-CVD oxide layer were driven by the liquid surface tension and precisely aligned on the host wafers, and subsequently, they were tightly bonded to the wafers through the MCtW oxide-oxide direct bonding technology. Finally, a mechanism of oxide-oxide direct bonding to support the previous models was discussed using an atmospheric pressure ionization mass spectrometer (APIMS). MDPI 2016-10-10 /pmc/articles/PMC6190075/ /pubmed/30404357 http://dx.doi.org/10.3390/mi7100184 Text en © 2016 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Fukushima, Takafumi Hashiguchi, Hideto Yonekura, Hiroshi Kino, Hisashi Murugesan, Mariappan Bea, Ji-Chel Lee, Kang-Wook Tanaka, Tetsu Koyanagi, Mitsumasa Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title | Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title_full | Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title_fullStr | Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title_full_unstemmed | Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title_short | Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration |
title_sort | oxide-oxide thermocompression direct bonding technologies with capillary self-assembly for multichip-to-wafer heterogeneous 3d system integration |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190075/ https://www.ncbi.nlm.nih.gov/pubmed/30404357 http://dx.doi.org/10.3390/mi7100184 |
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