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Wafer-Level Vacuum-Packaged Electric Field Microsensor: Structure Design, Theoretical Model, Microfabrication, and Characterization
This paper proposes a novel wafer-level vacuum packaged electric field microsensor (EFM) featuring a high quality factor, low driving voltage, low noise, and low power consumption. The silicon-on-insulator (SOI) conductive handle layer was innovatively used as the sensing channel to transmit the ext...
Autores principales: | Liu, Jun, Xia, Shanhong, Peng, Chunrong, Wu, Zhengwei, Chu, Zhaozhi, Zhang, Zhouwei, Lei, Hucheng, Zheng, Fengjie, Zhang, Wei |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2022
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9229140/ https://www.ncbi.nlm.nih.gov/pubmed/35744542 http://dx.doi.org/10.3390/mi13060928 |
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